Reflow of bpsg for sensor applications
WebJan 23, 2015 · The reflow process enables the BPSG film 20 to fill trenches of small width with high-aspect ratio. Heating used to reflow the BPSG film 20 can be achieved using either rapid thermal processing (RTP) or a conventional furnace in either a dry (e.g., N 2 or O 2) or wet (e.g., steam H 2 /O 2) ambient. WebSep 9, 1994 · As the technology pushes down to half-micron or below, a low flow angle BPSG film for pre- metal dielectric (PMD) becomes necessary. With high BP concentration BPSG, for example 4 X 6, low flow angle can be achieved after proper reflow. The drawback is that, frequently, BPSG crystal appears at smaller poly spacing. The combined sub …
Reflow of bpsg for sensor applications
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WebFeb 1, 2011 · As the addition of dopants to the oxide film effect the etch rate, the profile of the isotropic etch will change which in turn effects the electrical device properties, down … WebDielectric Thin Film Applications • Inter layer dielectric, or ILD, include PMD and IMD • Pre-metal dielectric: PMD – normally PSG or BPSG – Temperature limited by thermal budget • Inter-metal dielectric: IMD – USG or FSG – Normally deposited around 400 °C
WebJan 23, 2015 · The reflow process enables the BPSG film 20 to fill trenches of small width with high-aspect ratio. Heating used to reflow the BPSG film 20 can be achieved using either rapid thermal processing (RTP) or a conventional furnace in either a dry (e.g., N 2 or O 2) or wet (e.g., steam H 2 /O 2) ambient. WebBPSG films slope were the response observed after annealing process. The angles must be as low as possible in order to get a good topography of the BPSG films. The thickness of the BPSG film is 3500Å while the uniformity has to be maintained as low as 5%. The Boron and Phosphorus contents of the BPSG layer are 4.7% and 5.3% respectively.
WebApplication number US09/363,306 Inventor Yung-nien Teng ... Specifically, the reflow of the first BPSG layer 101 may be for 15-60 minutes (more preferably 30 minutes) at a temperature of 800-950° C. The reflow of the second BPSG layer 201 may be for 10-45 minutes at a temperature of 800-950° C. In the prior art, the reflow of the first BPSG ... WebEuropean Patent Application EP1142006 . Kind Code: A1 . Abstract: Abstract not available for EP1142006 Abstract of corresponding document: WO0031788 ... The first temperature is below a reflow temperature of the BPSG layer and the second temperature is sufficient to reflow the layer. After the substrate is heated to the second temperature ...
WebSep 1, 1993 · Reflow of BPSG for sensor applications Semantic Scholar. Borophosphosilicate glass (BPSG) has been investigated for both the surface …
WebThe primary application of BPSG is as a low-temperature flow-able PMD (see Figure 1.2). It is used to ensure adequate metal coverage over steps and into contact vias so that metal … hobart hs9 slicer manualWebFeb 21, 2011 · Abstract Chemically vapor deposited borophosphosilicate glass (BPSG) has been widely used in microelectronic device fabrication as interlayer dielectric film due to its excellent planarization, gettering and flow properties. A BPSG reflow step, performed either in a diffusion furnace or a RTP reactor, normally follows the deposition step. hro master trainerWebSep 1, 1993 · Borophosphosilicate glass (BPSG) has been investigated for both the surface planarization of plasma-etched and refilled trenches before etchback and structural layer deposition to enable the fabrication of genuine surface-micromachined double clamped … hobart hs7n slicerWeb950°C to 1 100°C for 10 to 30 seconds, steam reflow was done at 850*C for 30 minutes in H 2 and 02 ambient followed by a short anneal in N 2.The furnace-alone reflow step, done at 900'C for 30 minutes in N 2, is shown in Figure 2. e) Figure 1. SEM cross sections of BPSG reflow for a common steam reflow temperature of 850'C. RTP hobart hs9n parts manualWebFeb 21, 2011 · Abstract Chemically vapor deposited borophosphosilicate glass (BPSG) has been widely used in microelectronic device fabrication as interlayer dielectric film due to … hro mathWeb(BPSG) has been widely used for device planarization. Device evolution towards smaller feature size and restrictions on BPSG reflow temperature budget make a void-free BPSG … hobart hs8 meat slicerWebLater, the second BPSG film anneal, frequently called “reflow”, was introduced in IC device technology in order to smooth sharp edges and taper contact holes. This second anneal … hobart hsf3